JMSH1101MTL规格参数 |
|||
|---|---|---|---|
| Type | 中压MOSFET | ||
| RoHS | |||
| 制造商 | JJM | ||
| 类型 | N | ||
| VDS_Max/V | 110 | ||
| ID_Max /A | 430 | ||
| VGS(th)Typ/V | 2.6 | ||
| RDS(ON)Typ (mΩ)@VGS 10V | 1.1 | ||
| RDS(ON)Max (mΩ)@VGS 10V | 1.6 | ||
| RDS(ON)Typ (mΩ)@VGS 4.5V | |||
| RDS(ON)Max (mΩ)@VGS 4.5V | |||
| VGS_Max/V | ±20 | ||
JMSH1101MTL详情
110伏,430安培,1.1mΩ N通道功率 SGT MOSFET JMSH1101MTL
JMSH1101MTL特点
- 非常好低栅极电荷
- 100%UIS测试
- 100%ΔVds测试
- 无卤素;符合RoHS
JMSH1101MTL应用
- 负载开关
- PWM应用
- 电源管理
PowerJE®10x12


产品摘要
| Parameters | Value | Unit |
| VDSS | 110 | V |
| VGS(th)_Typ | 2.6 | V |
| ID(@VGS=10V) | 430 | A |
| RDS(ON)_Typ(@VGS=10V) | 1.1 | mΩ |

Pin Assignment

Schematic Diagram
JMSH1101MTL订购信息
| Device | Marking | MSL | Form | Package | Reel(pcs) | Per Carton (pcs) |
| JMSH1101MTL-13 | SH1101M | 1 | Tape&Reel | PowerJE®10x12 | 2000 | 10000 |
绝对最大额定值 (@ unless otherwise specified)
| Symbol | Parameter | Value | Unit | |
| VDS | Drain-to-Source Voltage | 110 | V | |
| VGS | Gate-to-Source Voltage | ±20 | V | |
| ID | Continuous Drain Current | TC=25°C | 430 | A |
| TC=100°C | 272 | |||
| IDM | Pulsed Drain Current (1) | Refer to Fig.4 | A | |
| EAS | Single Pulsed Avalanche Energy (2) | 1987 | mJ | |
| PD | Power Dissipation | TC=25°C | 500 | W |
| TC=100°C | 200 | |||
| TJ, TSTG | Junction & Storage Temperature Range | -55 to 150 | °C | |
热特性
| Symbol | Parameter | Max | Unit |
| RθJA | Thermal Resistance, Junction to Ambient(3) | 34 | °C/W |
| RθJC | Thermal Resistance, Junction to Case | 0.25 |
电气特性 unless otherwise specified)
| Symbol | Parameter | Conditions | Min. | Typ. | Max. | Unit |
| Off Characteristics | ||||||
| V(BR)DSS | Drain-Source Breakdown Voltage | ID=250μA, VGS=0V | 110 | - | - | V |
| IDSS | Zero Gate Voltage Drain Current | VDS=88V, VGS=0V | - | - | 1.0 | μA |
| IGSS | Gate-Body Leakage Current | VDS=0V, VGS=±20V | - | - | ±100 | nA |
| On Characteristics | ||||||
| VGS(th) | Gate Threshold Voltage | VDS=VGS, ID=250μA | 1.8 | 2.6 | 3.4 | V |
| RDS(ON) | Static Drain-Source ON-Resistance(4) | VGS=10V, ID=20A | - | 1.1 | 1.6 | mΩ |
| Dynamic Characteristics | ||||||
| Rg | Gate Resistance | f=1MHz | - | 4.4 | - | Ω |
| Ciss | Input Capacitance | VGS=0V, VDS=55V, f=1MHz | 8699 | 12179 | 17050 | pF |
| Coss | Output Capacitance | 2840 | 3976 | 5567 | pF | |
| Crss | Reverse Transfer Capacitance | 46 | 64 | 128 | pF | |
| Qg | Total Gate Charge | VGS=0 to 10VVDS=50V, ID=20A | 134 | 188 | 254 | nC |
| Qgs | Gate Source Charge | 40 | 56 | 75 | nC | |
| Qgd | Gate Drain("Miller") Charge | 31 | 44 | 59 | nC | |
| Switching Characteristics | ||||||
| td(on) | Turn-On DelayTime | VGS=10V, VDD=50VID=20A, RGEN=3Ω | - | 34 | - | ns |
| tr | Turn-On Rise Time | - | 59 | - | ns | |
| td(off) | Turn-Off DelayTime | - | 163 | - | ns | |
| tf | Turn-Off Fall Time | - | 96 | - | ns | |
| Body Diode Characteristics | ||||||
| IS | Maximum Continuous Body Diode Forward Current | - | - | 430 | A | |
| ISM | Maximum Pulsed Body Diode Forward Current | - | - | 1719 | A | |
| VSD | Body Diode Forward Voltage | VGS=0V, IS=20A | - | 1.2 | V | |
| trr | Body Diode Reverse Recovery Time | IF=20A, di/dt=100A/us | 87 | 122 | 165 | ns |
| Qrr | Body Diode Reverse Recovery Charge | - | 342 | - | nC | |
Notes: 1. Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature.
2. condition: Starting , , , , , , during time in avalanche.
3. is measured with the device mounted on a 1inch² pad of 2oz copper FR4 PCB.
4. Pulse Test: Pulse Width Duty Cycle
JMSH1101MTL典型性能特性

Figure 1: Power De-rating

Figure 2: Current De-rating

Figure 3: Normalized Maximum Transient Thermal Impedance

Figure 4: Peak Current Capacity

Figure 5: Output Characteristics

Figure 6: Typical Transfer Characteristics

Figure 7: On-resistance vs. Drain Current

Figure 8: Body Diode Characteristics

Figure 9: Gate Charge Characteristics

Figure 10: Capacitance Characteristics

Figure 11: Normalized Breakdown voltage vs. Junction Temperature

Figure 12: Normalized on Resistance vs. Junction Temperature

Figure 13: Normalized Threshold Voltage vs. Junction Temperature

Figure 14: vs.

Figure 15: Maximum Safe Operating Area
JMSH1101MTL测试电路

Figure 1: Gate Charge Test Circuit & Waveform


Figure 2: Resistive Switching Test Circuit & Waveform


Figure 3: Unclamped Inductive Switching Test Circuit& Waveform


Figure 4: Diode Recovery Test Circuit & Waveform

JMSH1101MTL封装外形尺寸数据(PowerJE®10x12)
Package Outline
Package Outlines
Top View
1. Dimension and tolerance per ASME Y14.5M, 1994.
Side View
NOTES:
2. All dimensions in millimeter.

Bottom View
| DIM. | MILLIMETER | ||
| MIN | NOM | MAX | |
| A | 2.20 | 2.30 | 2.50 |
| b | 0.70 | 0.80 | 0.90 |
| bl | 9.70 | 9.80 | 9.90 |
| b2 | 0.42 | 0.46 | 0.50 |
| C | 0.40 | 0.50 | 0.65 |
| D | 10.28 | 10.38 | 10.58 |
| D2 | 3.30 | ||
| E | 9.70 | 9.90 | 10.10 |
| E1 | 7.80 | ||
| E4 | 8.80 | ||
| E5 | 9.20 | ||
| e | 1.20(BSC) | ||
| H | 11.48 | 11.68 | 11.88 |
| HI | 6.55 | 6.75 | 6.85 |
| H2 | 7.30 | ||
| H3 | 3.20 | ||
| H4 | 3.80 | ||
| K1 | 4.18 | ||
| L | 1.70 | 1.90 | 2.10 |
| L1 | 0.70 | ||
| L2 | 0.60 | ||
| L4 | 1.00 | 1.15 | 1.30 |

Front View
Recommended Soldering Footprint
DIMENSIONS: MILITIMETERS